MULTILAYER INTERCONNECT SYSTEM
Contact:
 Laboratory
"Hybrid circuits technology"
phone: (+375 17) 2327115
e-mail:

Belarusian State University of Informatics and Radioelectronics
Address: 6, P.Brovka str., 220013, Minsk,
Republic of Belarus

Purpose and area of application

High-speed multichip modules (MCM), hybrid integrated circuits, switching boards and circuits of high integration density for a wide range of electronic devices.

Technical characteristics

Min. width of conductors and spacing between them, mkm

8 – 10

Conductor surface resistance, Ohm/sq

0,01

Impedance, Ohm

50 – 100

Resistance of interlayer isolation, Ohm

1012

Electrical strength of interlayer isolation, V/cm

2.105

Thin film resistor range, Ohm

10 – 2.105

Thin film specific capacitance range, pF/mm2

200 – 750

Advantages
  • surface planarity;
  • advanced integration;
  • reproducibility and perfect layout geometry precision;
  • great dissipation power;
  • option to embed passive, resistive and capacitive elements into the bulk of the metallization system;
  • high resistance to mechanical, temperature and electromagnetic effects;
  • reproducibility of electric parameters;
  • extended options for layout design.

 
For additional information please contact us at:
Transfer center of technologies phone: (+ 375 17) 2327115
e-mail:
http://www.transfer.by		 Belarusian State University of Informatics and Radioelectronics
phone: (+ 375 17) 2373610
fax: (+375 17) 2327183
e-mail:		 Ministry of Education for the Republic of Belarus