| TECHNOLOGY AND SOLUTION FOR THICK-LAYER CHEMICAL COPPER PLATING |
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Contact: Innovation division
phone/fax: (+375 17) 2095303
e-mail:
www.fhp.bsu.by |
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Research Institute of Physical-Chemical Problems of the Belarusian State University Address: 14, Leningradskaya str.,220050 Minsk,
Republic of Belarus
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Purpose:
Creation of plastic and soldering copper coatings with usage of original solution with specific complex of the stabilizing and modifying components for chemical deposition of copper.
Area of application: Instrument-makingindustry, electronics and microelectronics:
- formation of small-dimension (1-10 µm) copper foil on a substrate at continuous or selective metallization
- deposition of thick (up to 40 µm) high plasticity soldering copper coatings
- metallization of holes of printed circuit cards with replacing of galvanic operation
- metallization of blind holes and holes of small and ultra small diameter, down to full imperforation of them (for example, formation of vacuum-dense conductive connection in ceramic substrates at production of SHF- micro schemes)
- deposition of copper coatings instead of argentine coatings on functional ceramics and other substrates when other solutions do not allow to produce evenness of coatings
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Advantages:
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Implementation: Enterprises: «Vityaz» (Vitebsk), «Saturn» (Kiev, Ukraine), «Elkerm» (Minsk)
Forms of cooperation: Sale of the technology and know-how. Deposition of coatings on the small series of small-sized products of required thickness on any hydrophilic alkaliproof substrate under orders.
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phone: (+ 375 17) 2928342
fax: (+375 17) 2327183
e-mail: |
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Ministry of Education for the Republic of Belarus |
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