Purpose and area of application

It can be applied for:

• production of rigid and nonrigid printed circuit cards, including transient foramens, cables and apron-plates;
• production of multilayer printed circuit cards high density of mounting;
• manufacture of waveguides;
• production of heating elements (for irons, windscreens of automobiles).

Technical characteristics

• nature of dielectric substrate - polyimide, polyethylene terephthalate, polyamide, sitalles etc.
• nature of conductive metal - cuprum, nickel;
• set depth of conductors is provided with a chemical deposition from solutions of cuprum or nickel (up to 0,2 µm) and subsequent electrochemical deposition of cuprum (up to 25-35 µm) or chemical deposition of nickel (up to 12 µm);
• subsequent deposition of other metals and alloys (for example, gold, alloy Sn-Pb) is possible;
• minimum sizes of members at depth of conductors 0,2-5 µm are 10-20 µm, and at depth of 10-25 µm can be 40-100 µm
• minimum diameter of metallized holes at depth of dielectric 40 µm is 40 µm
• adhesion strength of a system "conductive element" is substrate of 500-800H/m
• insulance is determined by the nature of dielectric (in case of polyimide reaches 10⁴ MOhm)
• number of bends of a nonrigid substrate (polyimide) before cracking of copper conductors (at diameter of bend of 6 mm) is 6000

Advantages

• decrease of labour and materials' costs are twice as contrasted to halfaddive production technology of printed cards;
• variation of nature of deposited metal (cuprum, nickel, tin, gold etc.);
• variation of depth of coatings within the limits of 0,1-35 µm and more;
• production of conductive elements with small sizes, starting from 10 µm;
• production of elements, which are irrelevant one with another in the selfcontained scheme;
• usage of not metal cladding dielectrics of different chemical nature;

Forms of cooperation

• sale of the technology,
• manufacturing of items by the order,
• sale of the licenses,
• joint production.