Purpose and area of application

The materials are designed for both electrical insulation of and heat removal from heat-dissipating elements of electronic devices and heating-in-operation units and structures. They are made from heat-conducting ceramic particles using silicone resin as a binder and are produced in sheets and as a two-component compound. The materials are used for insulating mounting surfaces of semiconductor elements during assembling and as a dielectric material in electronic, electrical and thermal devices. Serve as a replacement for mica and heat-conducting pastes (e.g., KPT-8).

"Nomacon GS" is an elastic ceramic-polymer composite material reinforced with glass fabric. Due to the reinforcing layer the material possesses superior rupture and tear characteristics. A highly heat-conducting ceramic powder used as a filler offers total thermal conductivity on the level competitive with best foreign analogues. A thermally stable silicone-resin binder imparts the elasticity of a soft gum to the material, which ensures filling of microasperities of the mating surfaces thus decreasing the contact thermal resistance. As distinct from the known analogues, the thickness of material "Nomacon GS" can be varied from 0.15 to 2 mm and more at customer's request. The standard thickness is 0.22±0.05 mm.

Technical characteristics

Parameter

Value

1

10
15

(4-4,5)*10^-3

5,9-6,2

10¹⁴

1,9-2,0

-60 to +250

Type 2A2318 (TO 218, TO 247)           Type 2A1813 (TO 220)

Type 1A4229 (TO 3)                Type 1A3521 (TO 66)

Type 2A1310 (TO 126)                                TO-3P

DO-5                            DO-4