Purpose
Polishing suspensions represent ultradisperse colloid systems on a basis of the silica dioxide, stabilized by the organic and inorganic bases. Appearance - the matte liquid which is not containing extraneous mechanical inclusions, visible by the unaided eye. Suspensions are intended for polishing products of electronics. In particular, can be applied at a stage of finishing polishing of plates of monocrystal silicon.
Technical characteristics
The basic types of polishing suspensions: SPS - 54 - pure colloid silica dioxide without additives; SPS - 8 - for I stages of polishing of semi-conductor materials; SPS - 53, SPS - 55 - for II stage of polishing of semi-conductor materials.
Type of suspension |
SPS-55 |
SPS-53 |
SPS-8 |
SPS-81 |
SPS-54 |
Admixture, mass.%, Iron |
0,0002 |
0,0002 |
0,0002 |
0,0002 |
0,0003 |
Admixture, mass.%, Sodium |
0,4 |
0,4 |
0,0005 |
0,0005 |
0,0004 |
Admixture, mass.%, Potassium |
0,00005 |
0,00005 |
0,00004 |
0,00004 |
0,00004 |
Stabilizing base |
NaOH, KOH |
NaOH, KOH |
Ethylendiamin |
Ethylendiamin |
- |
Density, g/cm3 |
1,130-1,134 |
1,060-1,065 |
1,075-1,080 |
1,10-1,12 |
1,10-1,12 |
šĶ at 200C |
9,5-10,9 |
9,5-10,9 |
11,8-12,0 |
12,5-12,8 |
6,5-7,0 |
Size of particles of SiO2, nm |
50-100 |
10-40 |
10-40 |
50-100 |
50-100 |
Content of SiO2, mass.% |
20,0 |
10,0 |
12,5 |
20,0 |
16,0 |
Viscosity, MPa*c |
1,8 |
1,25 |
1,25 |
1,7 |
1,7 |
Stage of usage |
II stage |
II stage |
I stage |
I stage |
|
Recommended dilution |
1:10 |
1:5 |
1:3 |
1:5 |
|
šĶ after dilution |
10,5-10,6 |
10,5-10,6 |
11,8-11,9 |
12,2-12,3 |
|
Density after dilution, g/cm3 |
1,010 |
1,010 |
1,015 |
1,010 |
- |
Recommended type of polishing |
segal or polyvel |
segal |
polytan |
polytan |
segal, polyvel, polytan, oth. |
Serviceable life, months, at least |
6 |
6 |
6 |
6 |
6 |
Advantages
Suspensions on a basis of nano-particles of pyrogen silica dioxide (A-50 and A-100 grade) have high stability, high efficiency, good selectivity, the minimal pollution by ions of metals and are suitable for use at a stage planarization of metal layers at manufacture of integrated microcircuits. The competitive price.
Industry implementation: SE "Kamerton", SIU "Integral"
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